| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus capable of suppressing curvature of a substrate when the substrate is removed from a substrate mounting part after processing on the substrate. <P>SOLUTION: The semiconductor manufacturing apparatus comprises: a processing chamber in which a processing gas is supplied and which processes the substrate; a substrate mounting part in which a heater is incorporated and the substrate is mounted and heated by the heater; a substrate supporting part which has a first position for carrying out the substrate, a second position for processing the substrate and a third position midway between the first and the second positions as relative position relations between the substrate mounting part and the substrate supporting part, and supports the substrate at the first position or the third position; and a control part which positions the substrate supporting part at the second position at the time of the processing on the substrate, holds the substrate supporting part at the third position for a prescribed time after the processing on the substrate, and controls the substrate supporting part to position at the first position to carry the substrate out. <P>COPYRIGHT: (C)2012,JPO&INPIT |
