| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a prepreg in which different applications functions, performances, characteristics or the like can be given to both sides of the prepreg, and which has outstanding mechanical strength and durability; and to provide a substrate equipped with the prepreg, and a semiconductor device manufactured using the substrate. <P>SOLUTION: The prepreg 1 includes: a fiber base material 2 of a plate shape; a first resin layer 3 which is located on one surface side of the fiber base material 2, and consists of a first resin composition; and a second resin layer 4 which is located on the other surface side of the fiber base material 2, and consists of a second resin composition which has a composition different from the first resin composition. The first resin layer 3 has a first impregnating part 31 in which a part of the thickness direction of the fiber base material 2 is impregnated with the first resin composition. The second resin layer 4 has a second impregnating part 41 in which the remaining component of the fiber base material 2, which is not impregnated with the first resin composition, is impregnated with the second resin composition. In addition, the first impregnating part 31 and the second impregnating part 41 contact together in the fiber base material 2. <P>COPYRIGHT: (C)2012,JPO&INPIT |
