| 摘要 |
To provide a semiconductor chip capable of making a reflection circuit, a branching circuit, a matching circuit, and the like that are connected to a chip end function in an adequate manner. A semiconductor chip is arranged on a semiconductor substrate on which at least one semiconductor device 11 is formed and includes a wiring pattern 12, 14 connected to each terminal of the semiconductor device 11 and an electrode pad 13, 15 connected to the wiring pattern 12, 14 for connecting a signal input/output circuit that is formed on a separate substrate provided separately from the semiconductor substrate. The semiconductor chip includes a parallel wiring pattern 16, 18 connected to the wiring pattern 12, 14 on at least one terminal end of the semiconductor device; and a reactance-circuit connection electrode pad 17, 19 connected to the parallel wiring pattern 16, 18 for electrically connecting a reactance circuit that is formed on the separate substrate separately from the signal input/output circuit. |
