Contacting medium and process for contacting electrical parts

摘要

The sintered preform comprises a carrier having a surface having a structuring element containing a hardened paste. The hardened paste contains metal such as silver particles having a coating that contains an organic compound, and a sintering aid comprising organic peroxides, inorganic peroxides, inorganic acids, salts of organic acids, esters of organic acids (1-4C) and carbonyl complexes (1-4C). A molar ratio of sintering aids to the organic compounds contained in the coating is 1:1-150:1. A foil is applied on the structuring element. An independent claim is included for a method for connecting two components.