METHOD OF MANUFACTURING ELECTRONIC ELEMENT AND ELECTRONIC ELEMENT

摘要

PURPOSE: An electric component and a manufacturing method thereof are provided to selectively process a wiring layer while controlling the influence of an organic insulating layer or a buffer layer contacting the top and bottom of the wiring layer. CONSTITUTION: Wiring layers(21,22) are formed on a substrate(11). An organic insulating layer(12) is formed on the wiring layer. A laser beam of a wavelength having transparency about the organic insulating layer is irradiated to short circuit unit(23) of the wiring layer through the organic insulating layer. A hole(25) is formed by eliminating a laser beam irradiation region of the short circuit unit. The pulse width of the laser beam is less than 100ns.