ALIGNMENT MARKS IN SUBSTRATE HAVING THROUGH-SUBSTRATE VIA(TSV)

摘要

PURPOSE: An alignment mark of a substrate having through-substrate via is provided to improve accuracy of the formation of the alignment mark by forming functional through-substrate via while forming the alignment mark. CONSTITUTION: A wafer including a substrate is prepared. An interconnecting structure including a metal Line and via in inside is formed on the substrate. An alignment mark(14) is formed in the front of substrate. Through-substrate via is formed on the substrate. The through-substrate via comprises functional through-substrate via and alignment mark through-substrate via. The functional through-substrate via is formed in order to electrically connect a conductive feature of the front side of the substrate to a conductive feature of the rear side of the substrate.