发明名称 |
THERMALLY CONDUCTIVE FOAM PRODUCT |
摘要 |
A compressible, thermally conductive foam interface pad is adapted for emplacement between opposed heat transfer surfaces in an electronic device. One heat transfer surface can be part of a heat-generating component of the device, while the other heat transfer surface can be part of a heat sink or a circuit board. An assembly including the foam interface pad and the opposed electronic components is also provided. |
申请公布号 |
EP2427906(A1) |
申请公布日期 |
2012.03.14 |
申请号 |
EP20100772750 |
申请日期 |
2010.05.05 |
申请人 |
PARKER-HANNIFIN CORPORATION |
发明人 |
BERGIN, JONATHAN;SANTA FE, VICTORIA;SEVERANCE, CHRISTOPHER;ROSA, GARY |
分类号 |
H01L23/373 |
主分类号 |
H01L23/373 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|