DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A film for dicing tape integrated semiconductor rear side, and a method for manufacturing a semiconductor apparatus are provided to improve laser marking performance and adhesive properties with a wafer while improving manufacturing yield. CONSTITUTION: A dicing tape(3) comprises a base material(31) and an adhesive layer(32) formed on the base material. The adhesive layer is formed into a two-layered structure including a first adhesive layer(32a) and a second adhesive layer(32b). The surface of a film(2) for semiconductor rear side is protected by a separator until the surface is attached to the rear side of a wafer. The splitting resistance between the first adhesive layer and the second adhesive layer is stronger than the splitting resistance between the second adhesive layer and the film for the semiconductor rear side.