发明名称 |
THE PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME |
摘要 |
PURPOSE: A printed circuit board and a manufacturing method thereof are provided to arrange a seed layer during a pattern groove or a via hole manufacturing process by including metal filler inside of an insulating layer. CONSTITUTION: An insulating substrate includes an insulating layer(130). A plurality of metal fillers(130a) is dispersed in the insulating layer. A plurality of circuit pattern grooves(135) is formed on the surface of the insulating layer. A metal layer is formed on the inner wall of the circuit pattern groove. A plurality of buried circuit patterns(120,140) is arranged on the metal layer.
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申请公布号 |
KR20120023894(A) |
申请公布日期 |
2012.03.14 |
申请号 |
KR20100086161 |
申请日期 |
2010.09.02 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
YOON, SUNG WOON;SEO, YEONG UK;NAM, MYOUNG HWA;LEE, SANG MYUNG;KIM, BYEONG HO |
分类号 |
H05K1/05;H05K3/00 |
主分类号 |
H05K1/05 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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