发明名称 |
SEMICONDUCTOR COMPONENT COMPRISING AN INTEGRATED CAPACITOR STRUCTURE THAT HAS A PLURALITY OF METALLIZATION PLANES |
摘要 |
<p>A semiconductor component includes an insulating layer, which is configured on a semiconductor substrate and in which a capacitor structure is formed. Said capacitor structure comprises at least two parallel metallization planes, whereby at least one of said planes is configured in a lattice and inhomogeneous structure, which are electrically connected to the first metallization plane, extended at least partially into the cavities of the latticework metallization plane.</p> |
申请公布号 |
EP1497869(B1) |
申请公布日期 |
2012.03.14 |
申请号 |
EP20030724870 |
申请日期 |
2003.04.17 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
ABDALLAH, HICHEM;OEHM, JUERGEN |
分类号 |
H01L29/92;H01L21/02;H01L23/522;H01L27/06;H01L27/08 |
主分类号 |
H01L29/92 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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