发明名称 SEMICONDUCTOR COMPONENT COMPRISING AN INTEGRATED CAPACITOR STRUCTURE THAT HAS A PLURALITY OF METALLIZATION PLANES
摘要 <p>A semiconductor component includes an insulating layer, which is configured on a semiconductor substrate and in which a capacitor structure is formed. Said capacitor structure comprises at least two parallel metallization planes, whereby at least one of said planes is configured in a lattice and inhomogeneous structure, which are electrically connected to the first metallization plane, extended at least partially into the cavities of the latticework metallization plane.</p>
申请公布号 EP1497869(B1) 申请公布日期 2012.03.14
申请号 EP20030724870 申请日期 2003.04.17
申请人 INFINEON TECHNOLOGIES AG 发明人 ABDALLAH, HICHEM;OEHM, JUERGEN
分类号 H01L29/92;H01L21/02;H01L23/522;H01L27/06;H01L27/08 主分类号 H01L29/92
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