| 摘要 |
<p>PURPOSE: A film for a semiconductor device and a semiconductor device are provided to form an adhesion difference between areas by irradiating only an area corresponding to a semiconductor wafer bonding spot of an adhesive layer with an ultraviolet ray. CONSTITUTION: A dicing sheet attaching adhesive film(1) is laminated on a cover film(2) at a predetermined interval. A plurality of the dicing sheet attaching adhesive films is laminated while crossing to a cross direction. The dicing sheet attaching adhesive film includes a dicing film(11) and an adhesive film(12) laminated on the dicing film. The adhesive film includes a base material(13) and an adhesive layer(14) laminated on the base material. A peel force between the cover film and an adhesive film is smaller than the peel force between the dicing film and the adhesive film.</p> |
