METHOD FOR MANUFACTURING ELECTRONIC PARTS DEVICE AND RESIN COMPOSITION SHEET FOR ELECTRONIC PARTS ENCAPSULATION

摘要

PURPOSE: A method for manufacturing an electronic part device and a resin composition sheet for sealing an electronic part are provided to prevent a package substrate form being contaminated due to the leakage of a resin composition melted by easily obtaining overmold and under fill without using a jig. CONSTITUTION: A plurality of electronic components is arranged on a package substrate. A sheet B and a sheet A(7) are successively laminated on an electronic part mounting area of the package substrate. An end part of the entire perimeter of the sheet A is softened. An encapsulated space with the entire perimeter of the sheet A is sealed tightly. The sheet A, which coats the sheet B and the electronic part, is compressed. The under fill of the electronic part by the melt of the sheet B is performed.