| 摘要 |
<p>Disclosed are: a photocurable heat-curable resin composition which enables the formation of a cured coating film having PCT resistance, HAST resistance, electroless gold plating resistance and thermal shock resistance that are important properties for solder resists for semiconductor packages; a dry film and a cured product of the resin composition; and a printed wiring board having, formed thereon, a cured coating film (e.g., a solder resist) comprising those materials. Specifically disclosed is a photocurable heat-curable resin composition which is developable with an aqueous alkaline solution and comprises a carboxyl-group-containing resin having a photosensitive group (excluding a carboxyl-group-containing resin produced using an epoxy resin as a starting raw material), a photopolymerization initiator and a hydroxyl-group-containing elastomer.</p> |
