发明名称 |
ULTRASONIC BONDING TOOL, METHOD FOR MANUFACTURING ULTRASONIC BONDING TOOL, ULTRASONIC BONDING METHOD, AND ULTRASONIC BONDING APPARATUS |
摘要 |
An object of the present invention is to provide an ultrasonic bonding tool capable of bonding a lead wire, without any trouble, even to a surface of a thin-film base having a plate thickness of 2 mm or less such as a glass substrate. In the present invention, a surface portion of a chip portion (1c) of an ultrasonic bonding tool (1) used in an ultrasonic bonding apparatus has a plurality of planar portions (10) formed so as to be separated from one another, and a plurality of concavities (11) formed between the plurality of planar portions. Each of the plurality of planar portions (10) has a flatness of 2 µm or less. |
申请公布号 |
KR20120024804(A) |
申请公布日期 |
2012.03.14 |
申请号 |
KR20117030481 |
申请日期 |
2009.06.23 |
申请人 |
TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION |
发明人 |
YOSHIDA AKIO;KOGURA MASAHISA |
分类号 |
B23K20/10;B06B1/02 |
主分类号 |
B23K20/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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