| 摘要 |
PURPOSE: An adhesive for connecting counter electrodes is provided to have relatively low hardening temperature, high connection reliability, and good storage stability. CONSTITUTION: An adhesive for connecting counter electrodes comprises: a binder resin containing 100.0 parts by weight of a (meth)acrylate compound, and an epoxy resin of which average molecular weight is 5,000-70,000; 0.1-5 parts by weight of an imidazole based hardener; 0.1-10 parts by weight of an organic peroxide; and 0.5-3 parts by weight of water. The binder resin contains 70-95 weight% of the (math)acrylate compound, and 5-30 weight% of the epoxy resin of which average molecular weight is 5,000-70,000. The DSC exothermic peak temperature of the adhesive is 70-100 °C, and the viscosity at 25 °C. Is 10-50 Pa·s.
|
