| 摘要 |
<p>A package is configured by stacking a flat board (2a) whereupon a rectangular hole (5a) for storing a sensor chip (5) is formed, a flat board (2b) whereupon a hole section (6) to be a package inner channel for introducing a measurement target gas into the sensor chip (5) is formed, and a flat board (2c) whereupon hole sections which communicate with the package inner channel as an inlet (3a) and an outlet (3b) of the measurement target gas on the same end surface of the package are formed.</p> |
