发明名称 |
Equipment and method for cutting package |
摘要 |
A package cutting apparatus includes at least two spindles installed at a sawing robot and cutting a frame including a plurality of packages into packages using cutting bits; a frame loading jig loading the frame so that the frame is cut; and a frame-and-unit picker installed at an orthogonal robot to load and unload the frame on and from the frame loading jig, wherein a state of the cutting bit installed at the spindle is checked. |
申请公布号 |
US8132305(B2) |
申请公布日期 |
2012.03.13 |
申请号 |
US20070848152 |
申请日期 |
2007.08.30 |
申请人 |
CHOI TAI-KEW;SUN YONG-KYUN;YANG HEE-SANG;EUM YO-SE;JANG HO-SOO;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHOI TAI-KEW;SUN YONG-KYUN;YANG HEE-SANG;EUM YO-SE;JANG HO-SOO |
分类号 |
B23P23/00;B23C1/08;B23C5/10;B23C5/12 |
主分类号 |
B23P23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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