发明名称 Equipment and method for cutting package
摘要 A package cutting apparatus includes at least two spindles installed at a sawing robot and cutting a frame including a plurality of packages into packages using cutting bits; a frame loading jig loading the frame so that the frame is cut; and a frame-and-unit picker installed at an orthogonal robot to load and unload the frame on and from the frame loading jig, wherein a state of the cutting bit installed at the spindle is checked.
申请公布号 US8132305(B2) 申请公布日期 2012.03.13
申请号 US20070848152 申请日期 2007.08.30
申请人 CHOI TAI-KEW;SUN YONG-KYUN;YANG HEE-SANG;EUM YO-SE;JANG HO-SOO;SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI TAI-KEW;SUN YONG-KYUN;YANG HEE-SANG;EUM YO-SE;JANG HO-SOO
分类号 B23P23/00;B23C1/08;B23C5/10;B23C5/12 主分类号 B23P23/00
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