SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A semiconductor device and a manufacturing method thereof are provided to arrange a plurality of opening parts on an etching mask with respect to a single pixel, thereby increasing the contact area of a contact opening part. CONSTITUTION: A first conductive layer is arranged on a substrate. A first insulating layer is arranged by covering the first conductive layer. A first semiconductor film, a second semiconductor film, and an impurity semiconductor film are arranged on the first insulating layer. A second conductive film(114) and a third conductive film(116) are arranged on a thin film laminated body(112) and the first insulating layer. An etching mask(117) is formed on the third conductive film.