发明名称 RADIATION-SENSITIVE RESIN COMPOSITION, PROCESS FOR FORMING RESIST PATTERN AND POLYMER
摘要 <p>PURPOSE: A radiation-sensitive resin composition, a resist pattern forming method, and polymer are provided to improve the solubility to an alkali developing solution and a rinsing solution by increasing the dynamic contact angle of the composition in a dipping exposure process. CONSTITUTION: A radiation-sensitive resin composition includes first polymer containing a structural unit with a group represented by chemical formula i, radiation-sensitive acid generator, and second polymer with an acid releasing group. The fluorine element content of the first polymer is more than or equal to the fluorine element content of the second polymer. In chemical formula i, the Ra is hydrogen element, halogen element, nitro group, -R, -O-R, -CO-R, or -CO-O-R; the Ra1 is C1 to C20 monovalent branched hydrocarbon group, C3 to C20 monovalent aliphatic cyclic hydrocarbon group, C6 to C30 monovalent aromatic hydrocarbon group, or C3 to C20 monovalent aromatic-aliphatic hydrocarbon group; the Rb is C1 to C10 monovalent branched hydrocarbon group with at least one fluorine element or C3 to C20 monovalent aliphatic cyclic hydrocarbon group with at least one fluorine element. The Rb and the Ra are capable of forming a ring structure.</p>
申请公布号 KR20120023550(A) 申请公布日期 2012.03.13
申请号 KR20110077668 申请日期 2011.08.04
申请人 JSR CORPORATION 发明人 NAKAHARA KAZUO;NAKASHIMA HIROMITSU;KIMURA REIKO
分类号 G03F7/004;H01L21/027 主分类号 G03F7/004
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