| 摘要 |
In a processing apparatus, a plurality of processors which perform different kinds of processing is integrated on a first semiconductor substrate. A plurality of memories to be managed by the plurality of processors integrated on the first semiconductor substrate is integrated on a second semiconductor substrate. The plurality of processors integrated on the first semiconductor substrate includes respective separate memory controllers which control the memories to be managed that are integrated on the second semiconductor substrate. The semiconductor substrates are manufactured using different semiconductor manufacturing processes, and micro bumps are formed on their respective surfaces. The semiconductor substrates are stacked together in the thickness direction, and are connected to each other through the micro bumps. |
