发明名称 |
Adjustment method, substrate processing method, substrate processing apparatus, exposure apparatus, inspection apparatus, measurement and/or inspection system, processing apparatus, computer system, program and information recording medium |
摘要 |
When a host issues an analysis order that specifically instructs the analytical contents to an analytical apparatus (step 401), the analytical apparatus collects two types of measurement and/or inspection results from a measurement and/or inspection instrument (steps 403 to 409), and in step 411, the analytical apparatus analyzes the measurement and/or inspection results and optimizes processing conditions of a series of processes related to wafer W. In step 411, data related to a processing state of a processing apparatus is acquired from the processing apparatus as needed. In step 413, the measurement and/or inspection results and the optimization results are accumulated in a database, and the optimization results are transmitted to various processing apparatuses (including the measurement and/or inspection instrument). After that, the analytical apparatus sends a processing end notice to the host (step 417). |
申请公布号 |
US8134681(B2) |
申请公布日期 |
2012.03.13 |
申请号 |
US20070706377 |
申请日期 |
2007.02.15 |
申请人 |
OKITA SHINICHI;NIKON CORPORATION |
发明人 |
OKITA SHINICHI |
分类号 |
G03B27/32;G03B27/42;G03B27/52;G03B27/54 |
主分类号 |
G03B27/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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