| 发明名称 |
Stack structure and method of manufacturing the same |
| 摘要 |
A stack structure is formed by stacking and bonding a plurality of substrates. The stack structure includes bonding films each of which is interposed in a bonding region between, adjacent glass substrates, and bonded to oxygen atoms in the glass of the substrate by anodic bonding. |
| 申请公布号 |
US8133338(B2) |
申请公布日期 |
2012.03.13 |
| 申请号 |
US20080031517 |
申请日期 |
2008.02.14 |
| 申请人 |
TERAZAKI TSUTOMU;NAKAMURA OSAMU;TAKEYAMA KEISHI;NOMURA MASATOSHI;CASIO COMPUTER CO., LTD. |
发明人 |
TERAZAKI TSUTOMU;NAKAMURA OSAMU;TAKEYAMA KEISHI;NOMURA MASATOSHI |
| 分类号 |
B32B33/00;B01J19/00;B32B37/26;B81B1/00;B81C1/00;C03B23/20;C03C27/04;H01M8/02 |
主分类号 |
B32B33/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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