| 摘要 |
<p>Provided are a pressure-sensitive film and tape for semiconductor wafer processing, which are capable of reducing the occurrence of reflow cracks in packages, even if a package is picked up in a state in which a pressure-sensitive adhesive is attached to an adhesive layer. This pressure-sensitive film comprises a base film and a pressure-sensitive adhesive layer disposed on said base film, and is used to process semiconductor wafers. The loss in weight of the pressure-sensitive adhesive layer at the reflow temperature, as measured by differential thermal analysis, is not more than 1.5%. Furthermore, this tape for semiconductor wafer processing has a pressure-sensitive film comprising a base layer and a pressure-sensitive adhesive layer disposed on said base layer, and an adhesive layer disposed on the pressure-sensitive adhesive layer. The loss in weight of pressure-sensitive adhesive layer at the reflow temperature, as measured by differential thermal analysis, is not more than 1.5%.</p> |
