| 摘要 |
PURPOSE: A coin head for a substrate is provided to shorten a manufacturing process and time for forming a bump by simultaneously forming a flat type bump and a circular bump of on a substrate. CONSTITUTION: A coined portion(11) is formed in a lower part of a body(10). The coined portion pressurizes a top portion of a solder ball(3) when the body vertically declines. A protrusion part(12) is projected to a substrate(2) while being included in the coined portion. The protrusion portion disperses and transfers pressure, which is applied from the body, to the substrate. A driving portion(10a) drives the body.
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