| 摘要 |
PURPOSE: A solder resist composition for a light emitting diode is provided to prevent the reduction of whiteness and glossiness during a printed circuit board manufacturing process and a light emitting diode element loading process. CONSTITUTION: A solder resist composition for a light emitting diode includes 30-50 weight% of developing resin, 3-7 weight% of one or more resins selected from either silicon resin or epoxy resin, 5-15 weight% of photo-sensitive methacrylate compound, 2-6 weight% of a photo-polymerization initiator, 30-40 weight% of filler, and 1-10 weight% of a solvent. The developing resin is obtained by the reaction of cresol novolak epoxy acrylate and acid anhydride. The filler includes rutile-shaped titanium dioxide and aluminum hydroxide, amorphous silicon dioxide, organic acid, and alumina on the surface of rutile-shaped titanium dioxide. |
