| 摘要 |
PURPOSE: An apparatus for cooling a semiconductor wafer is provided to cool the whole surface of a tray with one cooling pipe line by arranging the cooling pipe line in zigzag. CONSTITUTION: A tray(1) includes a mounting side for mounting a semiconductor wafer(10). A cooling pipe line(2) is arranged inside the tray. Refrigerant cooling the semiconductor wafer, which is mounted on the mounting side, flows in the cooling pipe line. A vacuum pipe(3) is installed in the tray. The vacuum pipe adsorbs the semiconductor wafer mounted on the mounting side.
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