| 摘要 |
<p>PURPOSE: A circuit board unit, a manufacturing method thereof, and an electronic device are provided to improve a connection reliability between a package board and a circuit board by making a mounting height of the package board higher on the circuit board. CONSTITUTION: A circuit board unit is formed by combining a first board(27) with a second board(24) through a soldering member. A thermal expansion coefficient of the first board is different from the thermal expansion coefficient of the second board. A spacer(10) is arranged between the first board and the second board and is made of a thermal expansion material and a thermosetting material. A curing temperature of the thermosetting material is higher than the melting point of the soldering material. A space between the first board and the second board is determined by a height of the spacer.</p> |
