| 摘要 |
PURPOSE: A multilayer embedded printed circuit board and a manufacturing method thereof are provided to minimize a signal line and a power line, thereby minimizing parasitic effects affecting module performance. CONSTITUTION: A multilayer embedded printed circuit board(10) comprises a pattern antenna layer(70), a circuit layer(60), a first and second copper clad laminate(CCL), and component elements(40,50) which respectively include a core layer(20). The core layer is included in the first and second CCL. The component element is able to be mounted in a cavity(30) arranged in the first and second CCL. The component element is an active element or a passive device. The circuit layer is able to be arranged in the upper and lower surfaces of the first and second CCL. The pattern antenna layer is able to be arranged on the upper surface of a substrate which includes the circuit layer and first and second CCL. |
