FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE

摘要

PURPOSE: A film for a back surface of a flip chip type semiconductor is provided to improve a manufacturing yield by preventing or controlling an entire of a semiconductor package from being bent. CONSTITUTION: A dicing tape(3) includes a base material(31) and an adhesion layer(32) laminated on the base material. A film(2) for a semiconductor back side is arranged on the dicing tape. A tension storage modulus is 10GPa to 30GPa at 25°C after the thermal setting of the film for the semiconductor back side. The tension storage modulus is 0.5GPa to 7GPa at 25°C before the thermal setting of the film for the semiconductor back side. The film for the semiconductor back side is made of a resin composition including the filler of 65 weight% to 95 weight%.