LOW TEMPERATURE CURABLE EPOXY COMPOSITIONS

摘要

PURPOSE: Low temperature-curable epoxy composition is provided to have low activation temperature, good storage stability and physical strength by including the methylated polyalkylen polyamine epoxy adduct. CONSTITUTION: Low temperature-curable epoxy composition comprises at least one methylated polyalkylene polyamine epoxy adduct including one of primary or secondary amine blocked by a phenol resin, and two or more of tertiary amines. The composition comprises a phenol resin in chemical formula (A), a modified amine compound in chemical formula (B). The modified amine compound is a product obtained by reacting an epoxy resin and a methylated polyalkylene polyamine containing the one of primary or secondary amine and the two or more of tertiary amines.