发明名称 |
ADHESIVE RESIN COMPOSITION, LAMINATE USING SAME, AND FLEXIBLE PRINTED WIRING BOARD |
摘要 |
<p>Provided is an adhesive resin composition containing an epoxy resin and/or a phenoxy resin; an epoxy-containing copolymer obtained by copolymerizing a monomer having an epoxy group and an ethylenically unsaturated monomer that is copolymerizable with the monomer having an epoxy group; a thermoplastic resin; and a curing agent, wherein a copolymer having a weight-average molecular weight of 5,000 to less than 100,000 and a weight per epoxy equivalent of 3,500 g/eq or less is used as the epoxy-containing copolymer. The adhesive resin composition is capable of providing a one-part type adhesive solution that has a good compatibility of the polymer components, that has good flame retardancy and is halogen-free, and that has good storage stability. Also provided are a laminate and a flexible printed wiring board that use the adhesive resin composition.</p> |
申请公布号 |
KR20120022736(A) |
申请公布日期 |
2012.03.12 |
申请号 |
KR20117022379 |
申请日期 |
2010.03.26 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD.;SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. |
发明人 |
KAIMORI SHINGO;SUGAWARA JUN;MIZOGUCHI AKIRA;ASAI SYOUGO;YOSHISAKA TAKUMA;UENISHI NAOTA |
分类号 |
C09J163/00;B32B27/38;C09J7/02;H05K1/03 |
主分类号 |
C09J163/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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