| 摘要 |
FIELD: process engineering. ^ SUBSTANCE: invention relates to method of producing woodchip board with glossy coat from laminar coat. Proposed method comprises polishing woodchip board flat wide side and differs from known procedures in that it includes the following jobs: leveling, without chipping, of polished flat wide surface by compacting it by means of cylindrical or plate leveling body with its leveling surface heated to, at least 100 C, or has this temperature, applying coat on leveled surface by direct application of glossy coat from laminar material. ^ EFFECT: lower costs. ^ 22 cl, 2 dwg |
