STACKED MICROELECTRONIC ASSEMBLY WITH TSVS FORMED IN STAGES AND CARRIER ABOVE CHIP

摘要

PURPOSE: A stacked microelectronic assembly with TSVS formed in stages and a carrier above a chip is provided to improve a process of connecting the font side to the back side of a semiconductor chip. CONSTITUTION: A microelectronics element(102) comprises a front side(104). A plurality of conductive pads(106) are exposed to the front side. A dielectric layer is located in a semiconductor region. The surface(103) of the first element(110) is attached to the front side of the microelectronics element by the dielectric substance. A plurality of conductive elements(114) are electrically connected to the conductive pad. The conductive elements is attached to the contact(124) of the dielectric element(126) by using the member(128) of a bond metal.