| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component package which easily and securely performs hermetic sealing to an electronic component, such as a piezoelectric transducer, which requires sealing under a high degree of vacuum. <P>SOLUTION: An electronic component package hermetically seals an piezoelectric vibration piece. The electronic component package includes a lid which is joined to a base including a cavity which houses the piezoelectric vibration piece and hermetically seals the piezoelectric vibration piece. The base has one or more recessed parts on a surface joined to the lid, and the lid has a first sealing material and a second sealing material, which have different melting points. The first sealing material is arranged so as to correspond to the joined surface other than the recessed parts of the base, and the second sealing member is arranged so as to correspond to the recessed parts of the base. <P>COPYRIGHT: (C)2012,JPO&INPIT |
