发明名称 Contacting Means and Method for Contacting Electrical Components
摘要 A method is provided for connecting at least two components, in which a sintering preform is used. This preform includes a carrier having a surface that has at least one structuring element containing hardened paste, wherein the hardened paste contains: (a) metal particles having a coating that contains at least one organic compound; and (b) at least one sintering aid selected from the group consisting of (b1) organic peroxides, (b2) inorganic peroxides, (b3) inorganic acids, (b4) salts of organic acids, wherein the organic acids have 1-4 carbon atoms, (b5) esters of organic acids, wherein the organic acids have 1-4 carbon atoms, and (b6) carbonyl complexes. The surface of the carrier having the hardened paste is not reactive to the constituents of the paste.
申请公布号 US2012055978(A1) 申请公布日期 2012.03.08
申请号 US201113224514 申请日期 2011.09.02
申请人 HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG 发明人 SCHAEFER MICHAEL;SCHMITT WOLFGANG
分类号 B23K35/14;B23K31/02 主分类号 B23K35/14
代理机构 代理人
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