发明名称 |
AQUEOUS POLISHING AGENT COMPRISING SOLID POLYMER PARTICLES AND TWO COMPLEXING AGENTS AND ITS USE IN A PROCESS FOR POLISHING PATTERNED AND UNSTRUCTURED METAL SURFACES |
摘要 |
An aqueous CMP agent, comprising (A) solid polymer particles interacting and forming strong complexes with the metal of the surfaces to be polished; (B) a dissolved organic non-polymeric compound interacting and forming strong, water-soluble complexes with the metal and causing an increase of the material removal rate MRR and the static etch rate SER with increasing concentration of the compound (B); and (C) a dissolved organic non-polymeric compound interacting and forming slightly soluble or insoluble complexes with the metal, which complexes are capable of being adsorbed by the metal surfaces, and causing a lower increase of the MRR than the compound (B) and a lower increase of the SER than the compound (B) or no increase of the SER with increasing concentration of the compound (C); a CMP process comprising selecting the components (A) to (C) and the use of the CMP agent and process for polishing wafers with ICs. |
申请公布号 |
US2012058641(A1) |
申请公布日期 |
2012.03.08 |
申请号 |
US201013318964 |
申请日期 |
2010.04.19 |
申请人 |
RAMAN VIJAY IMMANUEL;GUBAYDULLIN ILSHAT;LI YUZHUO;BRANDS MARIO;LAN YONGQING;BASF SE |
发明人 |
RAMAN VIJAY IMMANUEL;GUBAYDULLIN ILSHAT;LI YUZHUO;BRANDS MARIO;LAN YONGQING |
分类号 |
H01L21/321;C09K13/00 |
主分类号 |
H01L21/321 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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