PROTECTIVE FILM FORMING METHOD, AND SURFACE FLATTENING METHOD

摘要

Provided is a method for flattening the surface of a substrate having irregularities on a film-formed surface, using an organic thin film-forming material having light-curable properties. Also provided is a method for forming a protective film. A gas of an organic thin film-forming material having light-curable properties is liquefied on the surface of a substrate (5) having irregularities, to form a liquid organic layer on the substrate surface (first liquid layer formation step T1), and formation is completed with the formation of a liquid organic layer on the surface (first growth termination step T2). In order to minimize evaporation of the liquid organic thin film material, pressure is set to a pressure at or above a first curing pressure which is the evaporation pressure of the organic thin film material, and the substrate is subjected to ultraviolet radiation to cure the film (flattening layer formation step T3), to form a flattening layer. When a first ceramic layer, a buffer layer and a second ceramic layer are deposited in that order on the flattening layer, a first and second ceramic layer having a thick total film thickness are formed.