发明名称 LASER BEAM MACHINING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a laser beam machining device capable of reducing cost as compared with a conventional one. <P>SOLUTION: In this laser beam machining device 1 including a machining means 3 to irradiate a workpiece held to a holding means 2 with a laser beam to be machined, the holding means 3 comprises a plurality of holding tables 2a-2d; the machining means 3 includes an oscillation part 4 for oscillating a laser beam, a plurality of optical devices 5a-5d arranged corresponding to the respective holding tables to guide the laser beam to the workpieces held to the holding tables, and a connection part 6 for distributing the laser beam oscillated from the oscillation part 4 to the respective optical devices; and each optical device includes a shutter part 51 for blocking the laser beam at optional timing, and a condensation part 52 for condensing the laser beam on the surface of the workpiece held to the holding table. Output can be effectively utilized in order to distribute the laser beam from the oscillation part 6 to the plurality of optical devices, and cost per one machining point can be reduced as compared with a conventional one. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012045585(A) 申请公布日期 2012.03.08
申请号 JP20100190559 申请日期 2010.08.27
申请人 DISCO CORP 发明人 NOMARU KEIJI;HOSHINO HITOSHI
分类号 B23K26/067;H01L21/301 主分类号 B23K26/067
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