| 摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently form a bump in each electrode pad without temporarily adhering a conductive ball using flux, when forming the bumps in the plurality of electrode pads formed on one side of a substrate in a prescribed pattern respectively using the conductive balls. <P>SOLUTION: This method uses a fixture 1 in which a plurality of hollow parts 11 for housing the conductive balls Bs respectively are formed correspondingly to the pattern, and includes a process for mounting the conductive ball to each of the hollow parts of the fixture, a process for disposing the substrate on the fixture by vertically aligning each hollow part with each electrode pad, and a process for at least making each conductive ball closely adhere to each electrode with vertical position relation between the fixture and the substrate held, and heating and fusing these conductive balls to form the bumps. The fixture is made up from a material which is not wetted when the conductive ball is fused while having a linear thermal expansion coefficient equal to that of the substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
