| 摘要 |
<P>PROBLEM TO BE SOLVED: To cool a resin sealed substrate without exerting adverse effect on electronic parts or the like after the resin seal molding of a substrate, on which the electronic parts or the like are mounted, to prevent the warpage thereof. <P>SOLUTION: In this substrate cooling device for cooling the resin sealed substrate 21A after resin seal molding, the feed device off the resin sealed substrate to which the substrate cooling device is adapted has a holder 40 for holding the resin sealed substrate 21A, the suction means provided to the holder 40 to suck the resin sealed substrate 21A and a cooling plate 31 having the close contact surface provided in the direction sucking the resin sealed substrate 21A by the suction means to permit the close contact with the resin sealed substrate 21A. The suction means has an elastic support part 32 for forming a closed space between the resin sealed substrate 21A and the close contact surface, the through-hole 33a provided to the cooling plate 31 so as to be positioned in the closed space to pierce the cooling plate 31 in the thickness direction thereof and a suction means 33c for sucking the air in the closed space through the through-hole 33a and a suction route 33b. <P>COPYRIGHT: (C)2012,JPO&INPIT |
