| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology for improving the heat resistance and transparency of an epoxy resin-acid anhydride curing system sealing agent used for resin sealing of an LED or the like. <P>SOLUTION: This epoxy resin composition includes a first component which is at least one compound selected from specific silsesquioxane derivatives of imperfect cage type and a second component which is a cation polymerization initiator or an acid anhydride as essential components. This epoxy resin composition includes a third component which is at least one selected from a non-silicon-based epoxy resin and a curing promoter as a component to be used, if necessary. <P>COPYRIGHT: (C)2012,JPO&INPIT |
