| 摘要 |
Disclosed herein are a single layer printed circuit board and a method for manufacturing the same. The single layer printed circuit board includes: an insulating layer having a plurality of holes, which are filled with a plating layer to form circuit patterns; a first protection layer stacked on one surface of the insulating layer to protect the circuit patterns formed in the insulating layer, the first protection layer having holes for exposing portions of the plating layer of the insulating layer; and a second protection layer formed on the opposite surface of the surface of the insulating layer, on which the first protection layer is formed, to protect the circuit patterns formed in the insulating layer. According to the present invention, a thin type printed circuit board can be provided. |
