SUBSTRATE FOR POWER MODULE, SUBSTRATE FOR POWER MODULE EQUIPTTED WITH HEAT SINK, POWER MODULE, AND MANUFACTURING METHOD OF SUBSTRATE FOR POWER MODULE

摘要

PURPOSE: A substrate for a power module and a substrate for a heat sink attachment power module and a manufacturing method thereof are provided to improve yield of initial junction by forming a sticking layer on the welded surface of a metal plate. CONSTITUTION: Sticking layers(24,25) containing Si and addition elements are formed. A ceramics substrate(11) and metal plates(22,23) are laminated by placing the sticking layer. The ceramics substrate and the metal plates are pressurized to a laminating direction and are heated at the same time. A molten metal domain is formed in the interface of the metal plate and the ceramics substrate. The ceramics substrate and the metal plate are welded by coagulating the molten metal domain.