| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor capable of suppressing cracks or exfoliation of an adhesion interface. <P>SOLUTION: This epoxy resin composition for sealing a semiconductor contains as indispensable components, an epoxy resin, a curing agent represented by formula (I) (in the formula, R represents a hydrogen atom or a hydrocarbon group which may have a substituent), and an inorganic filler. <P>COPYRIGHT: (C)2012,JPO&INPIT |
