A support system for a semiconductor device during a wire or ribbon bonding operation is provided. The support system includes a body portion defining an upper surface. The upper surface has an upper surface contact region configured to support at least a portion of a lower surface of a semiconductor device at a lower surface contact region during a wire or ribbon bonding operation. The support system also includes a plurality of protrusions on the upper surface contact region.
申请公布号
WO2011130205(A3)
申请公布日期
2012.03.08
申请号
WO2011US32028
申请日期
2011.04.12
申请人
ORTHODYNE ELECTRONICS CORPORATION;BYARS, JONATHAN, M.;COPPERTHITE, THEODORE, J.;VON TRESCKOW, H., HENRY
发明人
BYARS, JONATHAN, M.;COPPERTHITE, THEODORE, J.;VON TRESCKOW, H., HENRY