发明名称 |
METHOD FOR DIVIDING A LARGE SUBSTRATE INTO SMALLER ONES AND METHOD FOR CONTROLLABLY SELECTIVELY DEPOSITING A SEALANT MATERIAL |
摘要 |
<p>A technique comprising: forming a plurality of smaller substrates from one or more larger substrates by a reduction process according to which there is some possible variation size between the smaller substrates within a variation range; and, in advance of said reduction process, providing said one or more larger substrates with one or more detection marks whose size and location are selected such that after the reduction process each smaller substrate includes a portion of at least one of said one or more detection marks, said portion having one or more edges that coincide with at least a part of one or more edges of the smaller substrate whatever actual size the smaller substrate has within said variation range.</p> |
申请公布号 |
WO2011151453(A3) |
申请公布日期 |
2012.03.08 |
申请号 |
WO2011EP59215 |
申请日期 |
2011.06.03 |
申请人 |
PLASTIC LOGIC LIMITED;RIEDEL, DAVID;LIEHR, STEFAN;CORTEGA-CAGARA, RINA |
发明人 |
RIEDEL, DAVID;LIEHR, STEFAN;CORTEGA-CAGARA, RINA |
分类号 |
H05K3/00;H01L21/67;H01L23/31;H01L23/495;H05K1/02;H05K1/18;H05K3/28;H05K3/32 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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