| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for a light emitting device which is excellent in a heat dissipation property, capable of stabilizing light emission operation and capable of improving use efficiency of light, and to provide a light emitting device using the package. <P>SOLUTION: A ceramic substrate 10 having electrical insulation properties is provided. On a surface of the ceramic substrate 10, a first concavity portion 10e forming an outgoing radiation aperture of light is formed in a thickness direction of the ceramic substrate 10. A second concavity portion 10d for mounting a luminous element 3 in the first concavity portion 10e is formed in the thickness direction of the ceramic substrate 10. Wiring patterns 11a for supplying the luminous element 3 with electric power is formed in the first concavity portion 10e. On the ceramic substrate 10 situated at a location opposite to the outgoing radiation aperture across a mounting location of the luminous element 3 in the second concavity portion 10d, a metallization layer 12 having a light reflecting property is formed, in such a way to be electrically insulated from the wiring patterns 11a. <P>COPYRIGHT: (C)2012,JPO&INPIT |
