PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a package substrate capable of improving heat dissipation effect and achieving reduction in the thickness by causing an electronic device to contact with a metal layer directly, and to provide a method for manufacturing thereof.

SOLUTION: A package substrate comprises: a first metal layer 110; a heat dissipation layer 130 laminated on the first metal layer by intervening a first insulation layer 120; a cavity 135 formed in the heat dissipation layer; a mounting layer 132 formed in the cavity in contact with the first insulation layer; a first electronic device 140 mounted on the mounting layer; and a second insulation layer 150 covering at least a portion of the heat dissipation layer and the cavity.

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