| 摘要 |
Three types of UV semiconductor light-emitting chips (21) having different light-emitting wavelength bands are provided in a single package as UV semiconductor light-emitting chip groups (A, B, C). Parts of the light-emitting wavelength bands of the UV semiconductor light-emitting chip groups overlap, and main leads (28a, 28b, 28c) are provided which supply current independently to each of the UV semiconductor light-emitting chip groups in such a way that it becomes possible to control light emission of the UV semiconductor light-emitting chips (21) contained in each UV semiconductor light-emitting chip group. |
