DEVICE USING POROUS METAL FOR ELECTRICAL CONNECTION AND WIRING CONNECTION METHOD

摘要

PROBLEM TO BE SOLVED: To provide a wiring connection method which can surely electrically-connects a substrate having a device structure formed thereon and a substrate for sealing the substrate when anodically-bonding the substrates.

SOLUTION: A device 4 comprises a first substrate 40 and a second substrate 45 which are anodically-bonded and electrically-connected via porous metals 51 and 52 which comprise one or more metals selected from gold, silver, platinum and palladium having a purity of 99.9 mass% or more and an average grain diameter of 0.005-1.0 μm. The wiring connection method comprises: forming the porous metal (bump) on at least one of a connection electrode part of the first substrate and a connection electrode part of the second substrate; superposing the first and second substrates so that the connection electrode parts of the first and second substrates face each other while sandwiching the bump; then anodically-bonding the both substrates and simultaneously electrically-connecting the connection electrode parts of the first and second substrates via the porous metal.

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